1/4 XBP06V4E4GR-G transient voltage suppressor (tvs) limits parameter symbol test condition min. typ. max. units breakdown voltage v br i r =5ma 6.4 6.8 7.2 v leakage current i rm v rm =5v - - 1.0 a forward voltage v f i f =10ma - - 1.25 v inter-terminal capacity c t v r =0v, f=1mhz - 40 - pf parameter symbol ratings units peak pulse power (*1) ppk 70 w 120 power dissipation pd 1000 (*2) mw junction temperature tj 150 storage temperature ts t g - 5 5 +150 esd durability (*3)(*4) contact discharge vpp 30 kv ? product name package order unit XBP06V4E4GR-G * usp-4 3,000/reel etr2903-005 ta=25 general description a pplications four elements in usp-4 package (anode common ) high esd esd protection a bsolute maximum ratings packaging information (*1): tp=8/20 s (*2): this is a reference data taken by using the test board. (*3): test condition iec61000-4-2 standard (*4): criterion no damage to device elements 1. cathode 2. cathode 3. cathode 4. cathode tab. anode 3 4 2 1 bottom view marking rule pin configuration electrical characteristics ta = 2 5 ??? bp2(product number) ?? lot number product name * the ?-g? suffix indicates that the products are halogen and antimony free as well as being fully rohs compliant. 1.20.05 (0.6) 1.00.05 0.30.05 1pin indent
2/4 XBP06V4E4GR-G (1) reverse current vs. breakdown voltage (2) reverse current vs. reverse voltage 0.001 0.01 0.1 1 10 100 5.0 5.5 6.0 6.5 7.0 7.5 8.0 breakdown voltagev br (v) reverse currenti r (ma) -25 75 25 ta=125 0.0001 0.001 0.01 0.1 1 0123456 reverse voltagev r (v) reverse currenti r (ua) ta=125 25 75 -25 (3) breakdown voltage vs. operating temperature (4) reverse current vs. operating temperature 5.0 5.5 6.0 6.5 7.0 7.5 8.0 -50 0 50 100 150 operating temperatureta () breakdown voltagev br (v) i r =5ma 0.001 0.01 0.1 1 10 -50 0 50 100 150 operating temperatureta () reverse currenti r (ua) v r =5.25v 5v 3v (5) inter-terminal capacity vs. reverse voltage (6) forward current vs. forward voltage 0 10 20 30 40 50 60 70 80 90 100 0123456 reverse voltagev r (v) inter-terminal capacityct (pf) ta=25 f=1mhz 0.01 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 forward voltagev f (v) forward currenti f (ma) -25 25 ta=125 75 typical performance characteristics
3/4 XBP06V4E4GR-G usp-4 power dissipation board mount (tj max = 150 ) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w) 25 1000 150 0 125.00 power dissipation data for the usp-4 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. evaluation board (unit: mm) 1. measurement condition (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board: dimensions 40 x 40 mm (1600 mm 2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces. package heat-sink is tied to the copper traces. material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter 2. power dissipation vs. ambient temperature packaging information pd-ta? 0 200 400 600 800 1000 1200 25 50 75 100 125 150 ??ta S?p?pdmw pd vs. ta power dissi p ation: pd ( mw ) ambient temperature: ta ( )
4/4 XBP06V4E4GR-G 1. the products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. consult us, or our representatives before use, to confirm that the informat ion in this datasheet is up to date. 2. we assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. the products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. please use the products listed in this datasheet within the specified ranges. should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. we assume no responsibility for damage or loss due to abnormal use. 7. all rights reserved. no part of this dat asheet may be copied or reproduced without the prior permission of torex semiconductor ltd.
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